ASML

The first Silicon Repeater, known as SiRe 1, was completed by the engineers of Natlab at the end of 1973. This marked a significant milestone in the development of lithography technology for semiconductor manufacturing.

The PAS 2000, developed from the Silicon Repeater technology, was delivered to IBM, albeit a few weeks behind the original deadline. This marked the first external sale of the PAS 2000, showcasing its potential in the semiconductor manufacturing market.

ASM Lithographic Systems B.V. was founded as a joint venture between ASMI and Philips, with each owning 50% of the new firm. The joint venture aimed to continue the development and commercialization of the Silicon Repeater technology.

In 1986, ASML brought the PAS 2500 stepper to the market, featuring new alignment technology that laid the foundation for many future innovations in their machines. This year also marked the establishment of a partnership with lens manufacturer Carl Zeiss.

In 1988, ASML became independent and decided to keep the abbreviation ASML as its official company name.

ASML released the lithography system PAS 5500 in 1991, which became a highly successful platform for the company.

ASML became a publicly traded company in February 1995 in a US$170 million transaction.

In 1996, ASML introduced its step-and-scan system, which outpaced competitors by making 100 wafers per hour as opposed to the standard 60.

In 1997, ASML began studying a shift to using extreme ultraviolet and joined a consortium including Intel and other U.S. chipmakers for fundamental research.

In March 1998, ASML formed the Special Applications division to pursue lithography market opportunities for custom imaging solutions outside the area of the company's mainstream markets.

ASML made a significant deal as reported in Electronic Times on February 1, 1999.

ASML completed the acquisition of SVG for $1.6 billion, as reported in Electronic News on October 9, 2000.

ASML reported a loss of US$422.4 million and announced net sales of EUR $1.84 billion for the year ending December 31, 2001, compared to net sales of EUR $3.1 billion for the previous year. Despite the steep fall in revenue, results exceeded expectations of analysts and raised some hopes that the chip industry was beginning to emerge from its worst slowdown.

ASML was reported to be making progress in the chip industry in an article in Electronic Engineering Times on January 21, 2002.

The TWINSCAN AT:1150i debuted as the first immersion machine in 2003, marking a significant advancement in semiconductor technology.

In 2004, ASML celebrated its 20th anniversary, marking two decades of innovation and technological progress.

The share buyback program was initiated in 2006, and the company has been consistently repurchasing shares over the last five years, aiming to return cash to shareholders and manage liquidity effectively.

In 2007, ASML shipped the TWINSCAN XT:1900i immersion system with a numerical aperture of 1.35, the highest in the industry, enabling customers to produce smaller chip features by projecting light through a layer of water.

In 2008, ASML shipped the first YieldStar (250D) metrology system to customers, providing real-time measurements and corrections during chip manufacturing.

In July 2012, Intel announced a deal to invest $4.1 billion into ASML in exchange for 15% ownership, aiming to speed up the transition to 450 mm wafers and further development of EUV lithography.

In November 2013, ASML paused the development of 450 mm lithography equipment, citing uncertain timing of chipmaker demand.

In 2015, ASML suffered intellectual property theft when a number of employees were found stealing confidential data from its Silicon Valley software subsidiary.

The contribution of key leaders in ASML's history has played a significant role in shaping the company's success and impact in the semiconductor industry.

The development of EUV lithography for silicon nanosheet transistors represents a significant technological advancement in the semiconductor industry.

In 2018, the Trump administration tried to block the sale of ASML technology to China, amid the global chip shortage and the 'technological cold war' between the US and China.

The development of the next-generation EUV platform, EXE, with a higher numerical aperture of 0.55 and significantly faster stages, was ramped up in January 2024, showcasing the company's commitment to innovation.

In November 2020, ASML completed the acquisition of Berliner Glas Group, officially welcoming the Berliner Glas team to the ASML family, expanding the company's technological expertise and capabilities.

ASML is the sole producer of the expensive machines required for printing advanced microchips, which are crucial for the technology industry. The company's role in enabling the production of these microchips is vital for the entire technology sector.

The announcement of the Chips and Science Act highlights the importance of semiconductor technology and its impact on global supply chains and economic competitiveness.

ASML's acquisitions contribute to its position as the only supplier of EUV lithography machines, establishing a rare monopoly in the industry.

ASML's significance in providing the machines for printing chips is highlighted, emphasizing the world's dependence on the company for this crucial technology.

On October 18, 2023, ASML's stock experienced a drop as chip manufacturers pulled back on orders, impacting the industry.

ASML announced its intention to declare a total dividend for the year 2023 of €6.10 per ordinary share, marking a 5.2% increase compared to 2022.

ASML will announce its financial results for the fourth quarter and full year of 2024, providing insights into the company's performance and outlook for investors and stakeholders.

ASML's ex-dividend date for the interim dividend was set as February 5, 2024.

ASML set the record date for Euronext & Nasdaq as February 6, 2024.

ASML paid an interim dividend of €1.45 per ordinary share on February 14, 2024.

The General Meeting of Shareholders is scheduled to take place on April 24, 2024, where important decisions regarding the company's operations and future plans will be discussed and voted upon.

A new US market conversion with T + 1 trade settlement is set to occur on May 28, 2024, indicating a significant change in the company's trading process in the US market.

The 3.500% EUR bond issued by ASML Holding N.V. is scheduled to mature on December 6, 2025, marking an important event in the company's debt maturity schedule.

The 1.375% EUR bond issued by ASML Holding N.V. is set to mature on July 7, 2026, signifying another significant event in the company's debt maturity schedule.